JOURNAL ARTICLE

Shrinking interconnects beyond copper.

  • Published In: Science, 2025, v. 390, n. 6773. P. 572 1 of 3

  • Database: Academic Search Ultimate 2 of 3

  • Authored By: Kiani, Mehrdad T.; Cha, Judy J. 3 of 3

Abstract

The continuous downscaling of transistors in integrated circuits following Moore's law—doubling the number of transistors on a microchip about every 2 years—has been an extraordinary feat of engineering, pushing the limits of fundamental physics. A transistor is a key component that regulates electrical current flow between terminals (conductive connection points) by switching the current on or off. When the size of a transistor decreases, the switching speed increases, allowing an integrated circuit to process information more rapidly. However, as a transistor's dimensions scale down to the nanometer regime, interconnects—the metal wires that connect transistors and other circuit components on a microchip—become a major bottleneck for the processing speed (1, 2). Thus, advancing the performance of integrated circuits for next-generation electronic devices cannot be achieved solely through downscaling of transistors but requires the development of new interconnect materials. [ABSTRACT FROM AUTHOR]

Additional Information

  • Source:Science. 2025/11, Vol. 390, Issue 6773, p572
  • Document Type:Article
  • Subject Area:Computer Science
  • Publication Date:2025
  • ISSN:0036-8075
  • DOI:10.1126/science.adu7099
  • Accession Number:189138699
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