JOURNAL ARTICLE

US, Taiwan Clinch Deal to Cut Tariffs, Boost Chip Investment.

  • Published In: Bloomberg.com, 2026. P. N.PAG 1 of 3

  • Database: Business Source Ultimate 2 of 3

  • Authored By: Wingrove, Josh; Lee, Yian 3 of 3

Abstract

The article discusses a newly established trade pact between the United States and Taiwan aimed at reducing tariffs on Taiwanese goods and enhancing investment in the semiconductor sector. Under the agreement, tariffs on Taiwanese shipments will decrease from 20% to 15%, aligning them with rates from Japan and South Korea. Taiwan's semiconductor companies, particularly Taiwan Semiconductor Manufacturing Company (TSMC), are expected to invest $500 billion in U.S. operations, including the construction of additional chip manufacturing plants in Arizona. The deal also includes provisions for credit guarantees to support small- and medium-sized Taiwanese firms and aims to strengthen economic ties amid geopolitical tensions with China. [Extracted from the article]

Additional Information

  • Source:Bloomberg.com. 2026/01, pN.PAG
  • Document Type:Article
  • Subject Area:Diplomacy and International Relations
  • Publication Date:2026
  • Accession Number:190915232
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