Optimized Low-Power Design: Advanced Organic Semiconductor Material Properties and Fabrication Techniques for Organic Field-Effect Transistors.

Many flexible electronic applications are being explored for the development of organic transistors. Typically, they are composed of polymeric substrates. Although spin-coating gives large-area and homogenous layers, low molecular order causes it to have an adequate mobility of only 1 cm2/Vs or less when spun from a pure organic semiconductor (OSc) solution. Several layer-manufacturing methodologies have been suggested to solve this problem. The relative parameters of π – π stacking mode, π – π distance and π – π displacement have a significant impact on the charge transport process in any OSc layer. This review comprehensively discusses the current status of OTFT technologies, including material, device, architecture, various deposition techniques and the latest OFETs fabricated using this technique with improvements made in those devices to improve mobilities and on/off current ratios. The parameters observed for different printed transistors are also discussed herein. The review compares different fabrication techniques and materials, highlighting their impacts on OFET performance metrics such as mobility and on/off ratios. It emphasises the study of organic semiconductor materials primarily used in OFETs, the geometry of OFETs, and various low-cost fabrication techniques. The discussion includes organic semiconductor properties, OFET geometries, applications in flexible electronics, and various deposition methods such as inkjet printing, thermal evaporation, dip coating, drop casting, and spin coating. [ABSTRACT FROM AUTHOR]