Dynamic visualization study of in situ cleaning of polystyrene microparticles off silicon wafer surface.

The article focuses on the microscopic dynamic behavior of polystyrene latex (PSL) particles during the cleaning of single-crystal silicon wafers using ultrapure water. Through in situ visualization with a high-speed camera and theoretical modeling of forces such as van der Waals, surface tension, drag, and lift, four distinct particle motion modes were identified: (1) interface capture, where particles are trapped at the gas–liquid interface by surface tension; (2) particle collision, involving collisions between particles at the interface and those on the wafer surface leading to particle removal; (3) jump attachment, where particles detach from the wafer and reattach to neighboring particles due to lift forces; and (4) wall surface movement, characterized by particles initially moving slowly on the wafer surface before accelerating and detaching into the fluid. These findings provide a detailed mechanistic understanding of particle removal processes, offering theoretical insights for optimizing silicon wafer cleaning technologies in semiconductor manufacturing.