JOURNAL ARTICLE

Liquid Metal based Stretchable Room Temperature Soldering Sticker Patch for Stretchable Electronics Integration.

  • Published In: Advanced Functional Materials, 2023, v. 33, n. 36. P. 1 1 of 3

  • Database: Academic Search Ultimate 2 of 3

  • Authored By: Kim, Minwoo; Park, Jung Jae; Cho, Chulmin; Ko, Seung Hwan 3 of 3

Abstract

Researchers are eagerly developing various stretchable conductors to fabricate devices for next‐generation electronics. Most of the major problems in stretchable electronics happen at the connection between rigid and soft parts and the development of reliable soldering material is a major hurdle in stretchable electronics. Though there are attempts to devise new soldering processes for integrating chips and stretchable conductors, they still possess limitations such as mechanical stability, mass production, sophisticated processes, and restricted candidates for conductors and substrates. Here, this study presents a room‐temperature universal stretchable sticker‐like soldering process that can stretchably solder multiple spots at once and directly fabricates a stretchable device in an in situ manner while a target conductor is installed on one's body. The solder developed in this research possesses high conductivity with a unique freestanding feature enabling the process. It can be elongated when directly positioned between a rigid chip and a rigid conductor, demonstrating its extraordinary stretchability. It is expected that this simple but unique stretchable soldering technique utilizing the invented solder will allow the integration of functional stretchable conductors with highly advanced rigid chips for next‐generation stretchable electronics. [ABSTRACT FROM AUTHOR]

Additional Information

  • Source:Advanced Functional Materials. 2023/09, Vol. 33, Issue 36, p1
  • Document Type:Article
  • Subject Area:Technology
  • Publication Date:2023
  • ISSN:1616-301X
  • DOI:10.1002/adfm.202303286
  • Accession Number:171385894
  • Copyright Statement:Copyright of Advanced Functional Materials is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

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