JOURNAL ARTICLE

Research and analysis of voids in semiconductor laser diode packaging reflow soldering.

  • Published In: Microwave & Optical Technology Letters, 2023, v. 65, n. 5. P. 1339 1 of 3

  • Database: Academic Search Ultimate 2 of 3

  • Authored By: Xu, Peidong; Qian, Yang; Wang, Bin; Wang, Yong; Yue, Yuxin; Teng, Yunjie; Wang, Xiantao 3 of 3

Abstract

The causes of voids in the soldering layer during vacuum reflow soldering of semiconductor laser devices are investigated, as are the movement and change laws of bubbles in the voids under different reflow chamber settings. An ultrasonic scanner is used to test and experiment with a series of 1064 nm wavelength semiconductor lasers. A technique for detecting the void rate based on the wavelength difference is proposed based on the association between the device wavelength, junction temperature, and voids. The average void rate error when comparing measured and calculated values is just 1.5%, demonstrating the validity of this estimation technique for defining the void rate of the device and providing a theoretical and practical reference to analyze the void rate of the device. [ABSTRACT FROM AUTHOR]

Additional Information

  • Source:Microwave & Optical Technology Letters. 2023/05, Vol. 65, Issue 5, p1339
  • Document Type:Article
  • Subject Area:Technology
  • Publication Date:2023
  • ISSN:0895-2477
  • DOI:10.1002/mop.33488
  • Accession Number:162897848
  • Copyright Statement:Copyright of Microwave & Optical Technology Letters is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

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